- New
Thermal paste with carbon nanoparticles 15.2 W/mK for CPU GPU cooling overclocking efficient 3g AG TERMOPASTY AG-CARBON/3G
zł136.47
Tax included
The advanced AG-CARBON/3G thermal paste is a premium-class product designed for the most demanding cooling systems. By utilizing innovative carbon nanoparticles, this paste offers unmatched thermal conductivity of 15.2 W/mK. It is an ideal solution for overclocking enthusiasts, gamers, and professionals servicing high-performance workstations and gaming laptops.
The main advantage of the product is its ability to instantly transfer thermal energy from the surface of the processor (CPU) or graphics card (GPU) to the heatsink. Thanks to very low thermal impedance (below 0.0008 °C-in²/W), the paste minimizes thermal resistance, which translates into lower component operating temperatures, thereby extending their lifespan and ensuring more stable operation under load.
The AG-CARBON/3G paste features optimal density, making its application extremely simple and precise. The set includes a dedicated applicator that allows for even distribution of a thin layer of the preparation, which is crucial for achieving the best cooling results. The product is safe for electronic components – it does not conduct electricity, which eliminates the risk of short circuits in case of accidental leakage beyond the core perimeter.
An additional advantage is the wide operating temperature range from -20°C to as high as 130°C, which guarantees that the paste will not lose its properties even under extreme conditions. It is a durable product that does not dry out or harden over a long period, reducing the need for frequent cooling system maintenance. By choosing AG-CARBON/3G, you are investing in the highest performance and safety of your computer hardware.
Thermal paste with carbon nanoparticles 15.2 W/mK for CPU GPU cooling overclocking efficient 3g
Model: AG TERMOPASTY AG-CARBON/3G
EAN: 6931240046401 SKU: 931046407
- Extreme thermal conductivity of 15.2 W/mK
- Innovative formula using carbon nanoparticles
- Very low thermal impedance < 0.0008 °C-in²/W
- Dielectric product - does not conduct electricity
- Wide operating temperature range from -20°C to 130°C
- Includes a practical applicator (spatula) for precise application
- Long-term stability - the paste does not dry out and does not lose its properties
- Ideal for CPU, GPU, and other high-heat components
Description
The advanced AG-CARBON/3G thermal paste is a premium-class product designed for the most demanding cooling systems. By utilizing innovative carbon nanoparticles, this paste offers unmatched thermal conductivity of 15.2 W/mK. It is an ideal solution for overclocking enthusiasts, gamers, and professionals servicing high-performance workstations and gaming laptops.
The main advantage of the product is its ability to instantly transfer thermal energy from the surface of the processor (CPU) or graphics card (GPU) to the heatsink. Thanks to very low thermal impedance (below 0.0008 °C-in²/W), the paste minimizes thermal resistance, which translates into lower component operating temperatures, thereby extending their lifespan and ensuring more stable operation under load.
The AG-CARBON/3G paste features optimal density, making its application extremely simple and precise. The set includes a dedicated applicator that allows for even distribution of a thin layer of the preparation, which is crucial for achieving the best cooling results. The product is safe for electronic components – it does not conduct electricity, which eliminates the risk of short circuits in case of accidental leakage beyond the core perimeter.
An additional advantage is the wide operating temperature range from -20°C to as high as 130°C, which guarantees that the paste will not lose its properties even under extreme conditions. It is a durable product that does not dry out or harden over a long period, reducing the need for frequent cooling system maintenance. By choosing AG-CARBON/3G, you are investing in the highest performance and safety of your computer hardware.
Specification
Product type
Advanced thermal paste with carbon nanoparticles
Thermal conductivity
> 15.2 W/(m·K) - ensures extremely fast thermal energy transfer
Thermal impedance
< 0.0008 °C-in²/W - minimizes thermal resistance at the component interface
Composition
Specialized high-purity carbon-based mixture
Packaging
3 g syringe - allows for multiple applications and easy dosing
Color
Gray - facilitates control of surface coverage
Operating temperature
-20 °C ... 130 °C - full stability over a wide thermal range
Electrical conductivity
None - the paste is safe, does not cause electrical short circuits
Viscosity
Optimized for easy spreading of thin layers
Application
CPU processors, GPU graphics cards, chipsets, consoles, power LEDs
Durability
High resistance to drying and hardening during operation
Safety
Does not corrode metal surfaces (copper, aluminum, nickel)
Manufacturer / Brand
AG TERMOPASTY - renowned Polish manufacturer of electronic chemicals
Warranty
2 years (24 months)
Contents
1x 3g syringe of paste
1x Applicator (application spatula)
Dimensions, Weight
Product dimensions: 15 x 120 x 20 mm (D x W x H)
Packaging dimensions: 12 x 210 x 100 mm (D x W x H)
Product weight: 8 g
Weight with packaging: 14 g
Zum Download
931046407
9 Items
Specific References
- EAN13
- 6931240046401
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The advanced AG-CARBON/3G thermal paste is a premium-class product designed for the most demanding cooling systems. By utilizing innovative carbon nanoparticles, this paste offers unmatched thermal conductivity of 15.2 W/mK. It is an ideal solution for overclocking enthusiasts, gamers, and professionals servicing high-performance workstations and gaming laptops.
The main advantage of the product is its ability to instantly transfer thermal energy from the surface of the processor (CPU) or graphics card (GPU) to the heatsink. Thanks to very low thermal impedance (below 0.0008 °C-in²/W), the paste minimizes thermal resistance, which translates into lower component operating temperatures, thereby extending their lifespan and ensuring more stable operation under load.
The AG-CARBON/3G paste features optimal density, making its application extremely simple and precise. The set includes a dedicated applicator that allows for even distribution of a thin layer of the preparation, which is crucial for achieving the best cooling results. The product is safe for electronic components – it does not conduct electricity, which eliminates the risk of short circuits in case of accidental leakage beyond the core perimeter.
An additional advantage is the wide operating temperature range from -20°C to as high as 130°C, which guarantees that the paste will not lose its properties even under extreme conditions. It is a durable product that does not dry out or harden over a long period, reducing the need for frequent cooling system maintenance. By choosing AG-CARBON/3G, you are investing in the highest performance and safety of your computer hardware.